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TDA1170S
TV VERTICAL DEFLECTION
. . . . .
SYNCHRONIZATION CIRCUIT OSCILLATOR AND RAMP GENERATOR HIGH POWER GAIN AMPLIFIER FLYBACK GENERATOR VOLTAGE REGULATOR
FINDIP (Plastic Package) ORDER CODE : TDA1170S
DESCRIPTION The TDA1170S is a monolithic integrated circuit in a 12-lead quad in-line plastic package. It is intended for use in black and white and colour TV receivers. PIN CONNECTIONS
RAMP OUTPUT SUPPLY VOLTAGE FLYBACK GROUND POWER AMPLIFLIER OUTPUT POWER AMPLIFLIER SUPPLY VOLTAGE REGULATED VOLTAGE
1 2 3
12 11 10
RAMP GENERATOR COMPENSATION AMP. INPUT GROUND
4 5 6
9 8 7
OSCILLATOR SYNC. INPUT HEIGHT ADJUSTMENT
1170S-01.EPS
December 1992
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TDA1170S
BLOCK DIAGRAM
+ VS C4 DA
FREQ
6
2
3
5 RH C9
P1
TDA1170S
9
OSCILLATOR
VOLTAGE REGULATOR
FLYBACK GENERATOR
POWER AMPLIFLIER
4
C1 RG C8 SYNC 8 YOKE
SYNC CIRCUIT
RAMP GENERATOR
BUFFER STAGE
PREAMPLIFLIER
11 C5 C7 RE RD
7 TABS C2 P2 RA
12 1 LINEARITY
10
P3 C3
RB
RC C6
1170S-02.EPS
HEIGHT
RF
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SCHEMATIC DIAGRAM
TDA1170S
5
2
D8 Q16 Q10 Q15
Q1 Q25 D7
Q26
3
Q36
R7
D4 R3 Q11
R8
Q28
R10
Q29
Q35
Z1
Q21 Q22
Q6
Q4 A
Q20
Q12 R4 Q13 Q17
D
Q23 R9
Q5
D5
D6
4
Q3
Q33 Q30
Q31
Q18 Q27
Q37
Q34
C
B
Q14 Q9
Q7
R5
Q19 E
R6
D3 TABS
Q2
Q8
Q24
Q32
R1
R2
D1
6
9
8
7
12
1
10
11
TDA1170S
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1170S-03.EPS
TDA1170S
ABSOLUTE MAXIMUM RATINGS
Symbol VS V4 , V5 V10 Io Io Io I3 I3 I8 Ptot Tstg, Tj Parameter Supply Voltage at Pin 2 Flyback Peak Voltage Power Amplifier Input Voltage Output Peak Current (non repetitive) at t = 2msec Output Peak Current at f = 50Hz t 10sec Output Peak Current at f = 50Hz t > 10sec Pin 3 DC Current at V4 2 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly 1.5msec Pin 8 Current Power Dissipation : at Ttab = 90 C at Tamb = 80 C Storage and Junction Temperature Value 35 60 + 10 - 0.5 2 2.5 1.5 100 1.8 20 5 1 - 40, + 150 Unit V V V V A A A mA A mA W W C
THERMAL DATA
Max Max
1170S-02.TBL 1170S-03.TBL
Symbol Rth j-tab R th j-amb
Parameter Thermal Resistance Junction-tab Thermal Resistance Junction-ambient
Value 12 70
Unit C/W C/W
() Obtained with tabs soldered to printed circuit with minimized copper area.
ELECTRICAL CHARACTERISTICS (refer to the test circuits, VS = 35V, Tamb = 25C, unless otherwise specified) DC CHARACTERISTICS
Symbol I2 I5 - I9 - I10 - I12 - I12 Parameter Pin 2 Quiescent Current Pin 5 Quiescent Current Oscillator Bias Current Amplifier Input Bias Current Ramp Generator Bias Current Ramp Generator Current Ramp Generator Non-linearity Supply Voltage Range Pin 1 Saturation Voltage to Ground Pin 3 Saturation Voltage to Ground Quiescent Output Voltage Test Conditions I3 = 0 I4 = 0 V9 = 1V V10 = 1V V12 = 0 I7 = 20 A, V12 = 0 V12 = 0 to 12V, I7 = 20A 10 I1 = 1 mA I3 = 10 mA VS = 10V R1 = 10k , R2 = 10k VS = 35V R1 = 30k, R2 = 10k - I4 = 0.1A - I4 = 0.8A I4 = 0.1A I4 = 0.8A I7 = 20A VS = 10 to 35V V8 0.4V 2.07 1 1 1.7 4.4 8.8 0.9 1.9 1.4 2.8 6.5 6.6 1 2.2 2.3 Min. Typ. 7 8 0.1 0.1 0.02 20 0.2 Max. 14 15 1 1 0.3 24 1 35 1.4 2.6 4.75 9.45 1.2 2.3 2.1 3.2 6.9 7 Unit mA mA A A A A % V V V V V V V V V V V mV/V V M Fig. 1b 1b 1a 1b 1a 1b 1b - - 1a 1a 1a 1c 1c 1d 1d 1b 1b 1b - 1a
19
I12
I12 Vs V1 V3 V4
4.1 8.3
V4L V4H V6 V7 V6 V7 , VS VS V10 R8 4/9
Output Saturation Voltage to Ground Output Saturation Voltage to Supply Regulated Voltage at Pin 6 Regulated Voltage at Pin 7 Regulated Voltage Drift with Supply Voltage Amplifier Input Reference Voltage Pin 8 Input Resistance
6.1 6.2
1170S-01.TBL
TDA1170S
Figure 1 : DC Test Circuit Figure 1a Figure 1b
I2
V3 I3 + Vs
+ Vs I5
2
3 2 5
5
8
TDA1170S
9 I8 7 1k 12 TABS 10
4
9
TDA1170S
TABS 6 12 7
10
R1
- I9 1V 8V
- I12 R2
V4
V6
- I12
V7
- I10
1V
100k
1170S-04.EPS
1V
1170S-05.EPS
Figure 1c
+ Vs
Figure 1d
+ Vs
2
5
I4
2
5
V4H
9
TDA1170S
TABS 10
4
9
TDA1170S
TABS 10
4
4V
V4L
1170S-06.EPS
1V
I4
1170S-07.EPS
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TDA1170S
ELECTRICAL CHARACTERISTICS (refer to the test circuit, VS = 25V ; f = 50Hz ; Tamb = 25oC, unless otherwise specified) AC CHARACTERISTICS
Symbol Is I8 V4 V9 tfly fo f f VS f T tab Parameter Supply Current Sync. Input Current (positive or negative) Flyback Voltage Peak to Peak Oscillator Sawtooth Voltage Flyback Time Free Running Frequency Synchronization Range Frequency Drift with Supply Voltage Frequency Drift with Tab Temperature Iy = 1App (P1 + R1) = 300k, C2 = 0.1 F (P1 + R1) = 260k, C2 = 0.1 F I8 = 0.5mA VS = 10 to 35V Ttab = 40 to 120C 14 0.005 0.01 Iy = 1App Test Conditions Iy = 1App 500 51 2.4 0.7 42.2 48.5 Min. Typ. 140 Max. Unit mA A V V ms Hz Hz Hz Hz/V Hz/C
1170S-04.TBL 1170S-08.EPS
Figure 2 : AC Test Circuit
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TDA1170S
Figure 3 : Typical Application Circuit for Large Screen B/W TV SET (RY = 10, LY = 20mH, IY = 1APP)
VS = 22V D1 1N4001 C9 470F 25V TABS C1 0.1F C3 100F 25V 3 5 2 R11 3.3
4
C10 0.1F
SYNC. INPUT
C11 0.1F 8 R13 4.7k
9
T D A 1 1 7 0 S
6 7 12
R4 220k 11 C12 1.5nF 10 R5** 47k 1 P3 47k
C8
33pF R9** 27k
C7 1000F/16V
R8**
27k
C6 22F/16V
P1
100k R1
Linearity
R6 39k R7** 5.6k
R14 210
YOKE Ry = 10 Ly = 20mH
Hold
150k
C2
0.15F
P2 100k Height R2 180k
C4 0.1F
R3* 330k
C5 0.1F * ** Tolerance 5% Tolerance 2%
TYPICAL PERFORMANCE
Symbol VS Is tfly Ptot Iy Operating Supply Voltage Supply Current Flyback Time Power Dissipation Maximum Scanning Current (peak to peak) Parameter Value 22 145 0.7 2.3 1.2 Unit V mA W A
1170S-05.TBL
ms
For safe working up to Tamb = 60C a heatsink of Rth = 14C/W is required.
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1170S-09.EPS
R10* 1
TDA1170S
MOUNTING INSTRUCTION The junction to ambient thermal resistance of the TDA 1170S can be reduced by soldering the tabs to a suitable copper area of the printed circuit board (fig. 4) or to an external heatsink (fig. 5). Figure 4 : Example of P.C Board Copper Are is Used as Heatsink The diagram of fig. 6 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side "s" of two equal square copper areas having a thickness of 35 (1.4 mil). Figure 5 : Example with External Heatsink
1170S-10.EPS
Figure 6 :
Maximum Power Dissipation and Junction-Ambient Thermal Resistance versus "S"
Figure 7 :
Maximum Allowable Power Dissipation versus Ambient Temperature
1170S-12.EPS
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1170S-13.EPS
1170S-11.EPS
TDA1170S
PACKAGE MECHANICAL DATA : 12 PINS - PLASTIC FINDIP
D G e4
A
a1
I
b c c1 e5 e6 e3 E2 E e E1
K D
12
7
1
6
F
L
M
b1
Dimensions A a1 b b1 c c1 D E E1 E2 e e3 e4 e5 e6 F G I K L M
Min. 3.8 1.5 0.55 0.3
Millimeters Typ.
Max. 4.05 1.75 0.6 0.35
Min. 0.150 0.059 0.022 0.012
Inches Typ.
Max. 0.159 0.069 0.024 0.014
1.32 0.94 19.2 16.8 4.86 10.11 2.29 17.43 7.27 12.35 6.3 7.8 6.1 2.5 2.5 17.2 19.9 17.6 5.56 10.81 2.79 18.13 7.97 13.05 7.1 8.6 6.5 2.9 3.1 0.756 0.661 0.191 0.398 0.090 0.686 0.286 0.486 0.248 0.307 0.240 0.098 0.098
0.052 0.037 0.677 0.783 0.693 0.219 0.426 0.110 0.714 0.314 0.514 0.280 0.339 0.256 0.114
2.54 17.78 7.62 7.62 12.7 9.8
0.100 0.700 0.300 0.300 0.500 0.386
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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FINDIP.TBL
PM-FDIP.EPS

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